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    "WAFER ABRADING MACHINE TENDER"
    Job Description and Jobs

    DOT:   673.685-102

      Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back: Adjusts controls to set speed, time, and pressure of abrading belts according to specifications.

    Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer. Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope. Replaces worn abrading belts.


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