"WAFER BREAKER, SEMICONDUCTORS"
Job Description and Jobs
DOT: 726.687-046
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Breaks semiconductor wafers into individual $T3dies,$T1 using equipment and handtools: Places semiconductor wafer on pad, using tweezers. Taps wafer, using pencil tip, awl, or tweezers to break wafer into quarters. Places semiconductor wafer quarter on plastic square. Presses semiconductor wafer, using roller or air pressure equipment, to break wafer quarter into individual dies. Places individual dies in containers, using vacuum wand or brush. May break wafers, using chemical solutions and breaking equipment. |
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End Of Job Description for: "WAFER BREAKER, SEMICONDUCTORS"
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